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Old 06-17-2007, 12:24 PM   #1
waldman
 
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Default fine ceramic instead of Printed Circuit Board in Bluetooth dongle

I have heard that a new technology uses fine ceramics in the PCB of the
chipset of Bluetooth dongles. This is supposed to be more resistant to
interferance and heat. It also makes the chipset smaller and so the dongle.
Does anybody know about this?


 
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